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1. The postcure process involves removing the damaged parts of the circuit board.
后处理过程涉及去除电路板上的损坏部分。
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2. After the postcure, the circuit board was ready for assembly.
后处理完成后,电路板准备组装。
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3. During the postcure stage, the temperature is carefully controlled to prevent damage to the electronic components.
在后处理阶段,温度被小心控制,以防止电子元件受损。