solid-phase bonding process

  1. 固相焊接法

网络词典

solid-phase bonding process

英 ˈsɒlɪd-ˌpiːx-ˌbɔndɪŋ ˈprəʊses 美 ˈsɒlɪd-ˌpiːx-ˌbɔndɪŋˈprəʊses
名词 中文翻译:固相键合过程
同义词: ['Solid-Phase Bonding', 'Solid-State Bonding例句:1. The solid-phasebonding process is crucial for the stabilityof the material.(固相键合过程对于材料的稳定性至关重要。)2. In the solid-phasebonding process', 'atoms are arranged ina specific pattern to form a cohesive structure.(在固相键合过程中,原子被排列成特定的模式以形成一个结合的结构。)3. The solid-phase bonding processhas been widely used in themanufacturing of electronic devices.(固相键合过程在电子器件的制造中得到了广泛应用。)']

例句:

  1. 1. The solid-phasebonding process is crucial for the stabilityof the material.
    固相键合过程对于材料的稳定性至关重要。
  2. 2. In the solid-phasebonding process, atoms are arranged ina specific pattern to form a cohesive structure.
    在固相键合过程中,原子被排列成特定的模式以形成一个结合的结构。
  3. 3. The solid-phase bonding processhas been widely used in themanufacturing of electronic devices.
    固相键合过程在电子器件的制造中得到了广泛应用。